The Taipei Representative Office in Hungary is pleased to share that the Taiwan–Europe Chip Innovation Forum 2025 will take place in Dresden, Germany, on November 27–28, 2025.
Co-organized by the National Institutes of Applied Research (NIAR), imec, Europractice, and Technische Universität Dresden (TU Dresden), the Forum aims to foster international collaboration between Taiwan and Europe in the semiconductor field.
Under the main themes of Technology Innovation, Talent Cultivation, and International Collaboration, the Forum will bring together distinguished leaders from industry, academia, and policy to explore the latest developments and challenges in the semiconductor ecosystem.
Key topics include:
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Advanced Packaging and Silicon Photonics
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Smart Sensing and Emerging Memory Technologies
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Semiconductor Talent Cultivation and Industry–Academia Collaboration
The Forum will feature keynote presentations by ESMC and Synopsys, along with multiple technical and talent-oriented sessions that highlight the depth and potential of Taiwan–Europe cooperation in shaping the future of global semiconductor innovation.
The Taipei Representative Office in Hungary encourages the Hungarian academic, research, and industrial communities to participate in this event and contribute to advancing cross-regional innovation partnerships.
? For detailed program and registration, please visit:
? https://tecif.eu/
