Representative Lien Yu-Ping attended the “Taiwan Go Global – 2026 Taiwan–Southeast Asia Semiconductor Industry Exchange” event on May 6, where she exchanged views on semiconductor cooperation prospects with Terry Tsao, Global Chief Marketing Officer & President of Taiwan, SEMI, Linda Tan, President of SEMI Southeast Asia, and other industry representatives.
In her remarks, Representative Lien noted that semiconductors have become the cornerstone of global technological and economic development. From artificial intelligence (AI), high-performance computing (HPC), and 5G communications to electric vehicles and smart manufacturing, all rely heavily on semiconductor technology. Taiwan is a global leader in advanced chip manufacturing, while Malaysia plays a key role in assembly, testing, and electronics manufacturing services, making both sides highly complementary in the semiconductor supply chain. During her recent visit to ASE and TECOBAR in Penang, Representative Lien also witnessed Taiwanese companies continuing to expand their investments in Malaysia, demonstrating strong confidence in the local market.
Representative Lien further called on the Malaysian government to update the over-30-year-old bilateral investment agreement (BIA) with Taiwan to establish a more comprehensive investment protection framework, attract greater Taiwanese investment, and deepen bilateral cooperation in high-tech industries.
With the assistance of TECO, SEMI Taiwan, SEMI Southeast Asia, and the Malaysia Semiconductor Industry Association (MSIA) also signed a trilateral memorandum of understanding (MOU) after the event to further strengthen semiconductor industry exchanges and cooperation, opening a new chapter in Taiwan–Malaysia semiconductor partnership.
